1. 2. 3. material content data sheet sales product name ipw90r500c3 issued 29. august 2013 ma# MA000468410 package pg-to247-3-41 weight* 6047.78 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 9.945 0.16 0.16 1644 1644 leadframe non noble metal iron 7439-89-6 3.972 0.07 657 inorganic material phosphorus 7723-14-0 1.192 0.02 197 non noble metal copper 7440-50-8 3967.071 65.59 65.68 655951 656806 wire non noble metal aluminium 7429-90-5 4.076 0.07 0.07 674 674 encapsulation organic material carbon black 1333-86-4 19.973 0.33 3303 plastics epoxy resin - 379.496 6.27 62749 inorganic material silicondioxide 60676-86-0 1597.877 26.42 33.02 264208 330259 leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5270 5270 plating non noble metal nickel 7440-02-0 28.550 0.47 0.47 4721 4721 solder non noble metal tin 7440-31-5 2.459 0.04 407 noble metal silver 7440-22-4 0.946 0.02 156 non noble metal antimony 7440-36-0 0.378 0.01 0.07 63 626 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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